Boeing 电子电气术语定义

竹君子 · 发表于 2015-1-8 15:55:17

附件是 Boeing 电子电气术语定义，供参考

1 SCOPE
This specification is a collection of terms and definitions provided for the purpose of
improving communication in the use of Electric/Electronic BAC Process and BMS
Material specifications. The definitions used for solder joint characteristics herein comply
with IPC–T–50A and MIL–STD–2000A when specified.
2 APPLICABLE DOCUMENTS
Not applicable to this specification.
3 CONTENTS
Section Subject Page
1 SCOPE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 APPLICABLE DOCUMENTS . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3 CONTENTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4 DEFINITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 REQUIREMENTS AND/OR PROCEDURES . . . . . . . . . . . . . 60
LIST OF FIGURES
Number Title Page
FIGURE 1 ACCESS HOLE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
FIGURE 2 LANDS WITH ANCHORING SPURS . . . . . . . . . . . . . . . . . . . . 3
FIGURE 3 BOW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
FIGURE 4 CLEARANCE HOLE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
FIGURE 5 CLINCHED LEAD TERMINATION (AFTER SOLDERING) . . 11
FIGURE 6 CLINCHED–WIRE “THROUGH” CONNECTION . . . . . . . . . . 11
FIGURE 7 DELAMINATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
FIGURE 8 ETCHING INDICATOR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
FIGURE 9 GROUND PLANE CLEARANCE . . . . . . . . . . . . . . . . . . . . . . . . 25
FIGURE 10 HOLE BREAKOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
FIGURE 11 INTERSTITIAL VIA HOLE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
FIGURE 12 J–LEAD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
ORIGINAL ISSUE 19–MAR–1996
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BSS
7035
PAGE 2
REVISED
3 CONTENTS (Continued)
Number Title Page
FIGURE 13 DISTURBED SOLDER JOINT . . . . . . . . . . . . . . . . . . . . . . . . . . 30
FIGURE 14 SOLDER JOINT, ACCEPTABLE INSUFFICIENT FILL . . . . . 31
FIGURE 15 SOLDER JOINT, WETTING ANGLE . . . . . . . . . . . . . . . . . . . . 32
FIGURE 16 LAYER–TO–LAYER SPACING . . . . . . . . . . . . . . . . . . . . . . . . . 34
FIGURE 17 MEASLING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
FIGURE 18 NAIL HEADING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
FIGURE 19 NEGATIVE ETCHBACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
FIGURE 20 OUTGROWTH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
FIGURE 21 PITCH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
FIGURE 22 RESIN RECESSION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
FIGURE 23 SHADOWING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
FIGURE 24 TURRET SOLDER TERMINAL . . . . . . . . . . . . . . . . . . . . . . . . . 56
FIGURE 25 UNDERCUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
FIGURE 26 WEAVE TEXTURE/EXPOSURE . . . . . . . . . . . . . . . . . . . . . . . . 58
4 DEFINITIONS
“A” Stage (of Resin) – condition of low molecular weight of a resin during which the resin
is readily soluble, fusible and usually liquid.
Absorption – amount of moisture a given substance will assimilate and retain. It is an
important property consideration in the selection of insulating materials.
Absorption (Fiber Optics) – loss mechanism in optical fiber where signal intensity
decreases due to impurities such as OH ions in the glass.
Acceptance Angle – see “Numerical Aperture”.
Acceptance Tests – tests deemed necessary to determine acceptability of product and as
agreed to by purchaser and vendor.
Access Holes – series of holes in successive layers. Each set having a common center
or axis. These holes in a multilayer printed board provide access to the surface of the
land in one of the layers of the board. (See Figure 1.)
Figure 1 ACCESS HOLE
ORIGINAL ISSUE 19–MAR–1996
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BSS
7035
PAGE 3
REVISED
4 DEFINITIONS (Continued)
Accumulated Gap, Cabling – sum of individual gaps between wires, measured between
wires of a lay after bringing the remaining wires in contact with each other.
Acid Fluxes – See “Corrosive Fluxes”.
Activating – treatment that renders a surface receptive to subsequent processing or
deposition of a desired material or substance. (Non–preferred synonyms “Seeding”,
“Catalyzing” and “Sensitizing.)
Active Device – component part exhibiting transistance. See “Transistance”.
Actuating Force – force required to change the state of a device, for example, on to off,
stationary to moving.
Additive Process – process for obtaining conductive patterns by the selective deposition
of conductive material on unclad base material. (See “Semi–Additive Process” and
“Fully–Additive Process”.)
Adhesion Promotion – process of preparing a surface to provide adhesion for subsequent
bonding processes.
Admittance – measure of ease with which an alternating current flows in a circuit. The
reciprocal of impedance.
Air Gap – portion of the space between electrical conductors occupied by air or that
portion of a magnetic circuit which is air or another substance of low permeability.
Air Voids – absence of resin in a localized area.
Ambient – surrounding environment coming into contact with the system or component in
question.
Ambient Temperature – temperature of the medium (air, gas, liquid, etc.) surrounding an
object. This temperature may be used as a base or reference point.
Ampere (A) – unit of current. It is the current flowing through one ohm of resistance at
one volt potential.
Anchoring Spurs – extensions of the lands on flexible printed wiring, extending beneath
the cover layer to assist in holding the lands to the base material.
Figure 2 LANDS WITH ANCHORING SPURS
ORIGINAL ISSUE 19–MAR–1996
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BSS
7035
PAGE 4
REVISED
4 DEFINITIONS (Continued)
Annular Ring – portion of conductive material completely surrounding a hole.
Antireflection (AR) Coating – lens coating, predominantly Magnesium Fluoride, (MgF),
used in fiber optics to reduce 2 reflection from light incident at an air–to–glass interface.
Antistatic Sprays – chemical agents which, when applied to non–conductive dielectric
surfaces, inhibit the surfaces ability to develop and maintain a high potential above
ground.
Approved Assembly Drawing – assembly drawing that has been authorized and approved
by the acquiring activity or an authorized representative.
Arc Resistance – resistance of a material to the effects of a high voltage, low current arc
(under prescribed conditions) passing across the surface of the material. The resistance
is stated as a measure of total elapsed time required to form a conductive path on the
surface (material carbonized by the arc).
Artwork – accurately scaled drawing of the etched circuit configuration used to produce
the master pattern.
Artwork Master – accurately–scaled (usually 1:1) pattern which is used to produce the
Production Master.
Aspect Ratio – ratio of the PWB thickness to the diameter of the hole through it.
Assembly – number of parts or subassemblies, or any combination thereof, joined
together to perform a specific function.
NOTE: When this term is used in conjunction with other terms listed herein the following
definitions shall prevail:
Printed–wiring assembly – printed–wiring board on which separately
manufactured components and parts have been added.
Multilayer printed–wiring assembly – multilayer printed–wiring board on which
separately manufactured components and parts have been added.
Printed–circuit assembly – printed–circuit board on which separately
manufactured components and parts have been added.
Multilayer printed–circuit assembly – see multilayer printed–wiring assembly.
Printed–board assembly – see printed–wiring assembly.
Attachment Pad – see “Circuit Pad”.
Attenuation (Optional) – measure of the decrease in energy transmission (loss of light)
expressed in dB. (In optical waveguides it is primarily due to absorption, scattering and
bending losses.) Attenuation is expressed as the logarithm of the ratio of output power to
input power.
Automated Component Insertion – act or operation of assembling individual components
to printed boards by means of computer–controlled component–insertion equipment.
ORIGINAL ISSUE 19–MAR–1996
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BSS
7035
PAGE 5
REVISED
4 DEFINITIONS (Continued)
Backpanel – see “Backplane”.
Backplane – interconnection device having terminals (such as solderless wrapped
connections) on one side and usually having connector receptacles on the other side;
used to provide point–to–point electrical interconnections. The point–to–point electrical
interconnections may be printed wiring. (See also “Mother Board”. )
“B” Stage (of Resin) – condition of a resin polymer when it is more viscous, with high
molecular weight, less soluble than “A” Stage but is still plastic and fusible.
Backshell, Connector – outside case which attaches to the wire entry end of the
connector and can serve in three capacities as follows: (1) straight backshell serves as
grommet follower only, (2) straight backshell with cable strain relief serves also as a
grommet follower, and (3) 45 to 90 degrees backshell with strain relief serves also as a
grommet follower and can be variably located (clocked) to provide for cable take off.
Angle backshells can be solid or open over the curved portion.
Backswing – amplitude of the first maximum excursion in the opposite amplitude direction
after the trailing edge of a pulse.
Bandwidth – (1) The range of frequencies over which a particular instrument or system is
designed to function within specified limits. (2) The difference between specified
frequencies.
Barrel – portion(s) of a terminal or contact that is (are) crimped. When designed to
receive the conductor, it is called the wire barrel. When designed to support or grip the
insulation, it is called the insulation barrel.
Base, Circuit Board – insulation support for the printed circuit.
Base Material – insulating material upon which the conductor pattern may be formed.
The base material may be rigid or flexible. It may be a dielectric sheet or insulated metal
sheet.
Base Material Thickness – thickness of the base material excluding metal foil or material
deposited on the surfaces.
Basic Dimension – numerical value used to describe the theoretical exact location of a
feature or hole. It is the basis from which permissible variations are established by
tolerances on other dimensions, in notes, or by feature control symbols.
Basic Structure – major pay–load carrying and electrically–integral metallic portion of an
airplane, missile, spacecraft or other manufactured product.
Batch – one or more assemblies or manufacturing unit that are processed together.
Bellows Contact – connector which is a flat spring folded to provide a uniform spring rate
over the full tolerance range of the mating unit.